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Hybrid Microcircuits/ Semiconductor Packaging

Automated PCB Process Control

This powerful inspection & programming tool brings together all variables in a virtual environment to eliminate problems before production. Inspect bare PCBs (holes, silk screen, soldermask, etc.

Epoxy, Via, and Via Fill Inspection Offline

ScanINSPECT ADI provides 100% verification of absence / presence of glue dot dispensing before entering the placement environment. Provides offline inspection for SPC sampling of low volume production.

Epoxy, Via, and Via Fill Inspection Inline

When integrated in the production line, provides 100% verification of absence and presence of glue dot dispensing before entering the placement.

Ball and Bump Placement Inspection Offline

100% inspection (AOI) of solder balls placed on subtrates or wafers on a desktop platform.

Ball and Bump Placement Inspection Inline

100% INLINE inspection (AOI) of solder balls placed on subtrates or wafers.

Solder Paste Inspection Offline

ScanINSPECT SPI provides 100% 2D non-contact verification of bridging, paste on pads, and the total area of solder paste before adding further value to the PCB. Provides offline inspection for low volume production or SPC sampling for high volume production.

Solder Paste Inspection Inline

ScanINSPECT SPI provides 100% 2D non-contact verification of bridging, paste on pads, and the total area of solder paste before adding further value to the PCB. Missing, paste off pad, bridging, and over/under area solder paste defects are automatically detected.

Wire Bond Inspection Offline

ScanINSPECT WBI provides 100% 2D non-contact verification of absence / presence of Al or Au wire bonds before adding further value to the assembly. Used as offline inspection for low volume production or SPC sampling for high volume production.

Wire Bond Inspection Inline

When integrated inline, ScanINSPECT WBI provides 100% 2D non-contact verification of absence / presence of Al or Au wire bonds before adding further value to the assembly. This process increases product yield by ensuring accurate wire bond placement.

Film/Photo 

Tool Inspection ScanINSPECT AFI

100% Inspection (AOI) of film and diazo after photoplotting and development. Check against Gerber data or use geometry inspection to inspect for mouse bites, opens/shorts, dust, pinholes and verify position and size of pads and tracks.

 

Film/Photo 

Tool Inspection

ScanINSPECT
AFI - LE

Lite Edition

100% Inspection (AOI) of film and diazo after photoplotting and development. Check against Gerber data or use geometry inspection to inspect for mouse bites, opens/shorts, dust, pinholes and verify position and size of pads and tracks.

 

LTCC, HTCC Hybrid Inspection Offline

100% automatic inspection of stencils and screens after fabrication and/or cleaning.

 

LTCC, HTCC Hybrid Inspection Inline

100% automatic inspection of stencils and screens after fabrication and/or cleaning.

 

Stencil Inspection 

& Screen 

ScanStencil

100% automatic inspection of stencils and screens after fabrication and/or cleaning.

 

Stencil Inspection 

& Screen ScanStencil - LE

Lite Edition

100% automatic inspection of stencils and screens after fabrication and/or cleaning.

 

Skip Mark Mapping

Skip marks on multi-up boards are easily detected and information sent to the placement machines. This provides a cost-reducing solution to the placement machines checking each board within the panels.

 

CAM Interface Utility

A full-featured, CAM software solution, capable of handling the toughest job. Includes a seamless interface to ScanCAD inspection products. 

 

 

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