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ScanINSPECT BPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive high-end AOI systems.


ScanINSPECT BPI uses a simple Windows user interface integrated with an image-processing unit. This combination allows 100% inspection of ball or bump placement on a wide variety of substrates and device types including FR4, Ceramic, Wafer, Flip chip, BGA, CSP, etc. The system can be used either pre or post reflow.




0.3mm balls


How Does ScanINSPECT BPI Work?

ScanINSPECT BPI's integration within the production environment provides inspection of ball or bump:


  • Presence/Absence
  • Size
  • Position

Each device or substrate is placed into ScanINSPECT BPI for 100% inspection. The balls or bumps are inspected and any errors are displayed on the screen. No more surprises!







Fast & Simple Programming

ScanINSPECT BPI is quickly programmed from a golden part in a few minutes. Corrections to the golden part can be quickly and easily made, if necessary.



Increased Yield & Improved Overall Equipment Efficiency

ScanINSPECT Ball Placement Inspection (BPI) is a powerful 100% inspection process control tool which increases product yield by ensuring accurate ball or bump placement. Missing balls or bumps can result in reduced yield, lost production time and extensive rework.


Missing or misplaced balls or bumps are now automatically detected. Problems are identified and eliminated before substrates or devices are reflowed, permitting quick and easy rework.






SScanINSPECT BPI set up is fast and easy. In production, each device or substrate is placed on the table, shuttled in, automatically aligned and checked for accuracy with a PASS or FAIL inspection in seconds.






  • Mandatory: 100% automatic inspection of ball or bump placement, pre and/or post reflow.
  • Security:     Confirm ball/bump absence / presence.
  • Necessity:   Detect errors before reflow permitting easy rework.
  • Flexibility:    System is tailored to meet specific customer's requirements.



Technical Specifications*

System Specifications*

  • Maximum Board Size: 18" X 20" (457mm X 508mm)**
  • Minimum Board Size: 2" x 2" (50mm x 50mm)
  • Maximum Inspection Area: 16.5" X 20" (419mm X 508mm)
  • Scanning Resolutions range from 200 to 2400 dpi
  • SMEMA Interface
  • CE Certified

** XL size conveyor





  • Power Supply: 230V / 50 Hz or 110V / 60 Hz (jumper selectable)
  • Power input: 0,75kW


Footprint of Inspection Unit

  • Length: 41.7" (1060mm)
  • Width: 42.9" (1089mm)
  • Height: 57" (1450mm) excluding light tower
  • Weight: 330lbs. (150kg)




  • Multi Core Processing - 3 GHz
  • 1 TB 7200 RPM HD, 8 - 16 GB RAM
  • CD/DVD ROM - for archive purposes
  • Flat Panel Monitor (17” or larger)
  • Ethernet connection
  • Win 10 - 64-Bit
  • 2 available USB ports - USB2 OR USB3

    *Recommended customer-supplied minimum PC requirements.



The following are trademarks of the indicated companies: Gerber, Ucamco N.V.; Windows  10 Microsoft®. ScanCAD™ and ScanINSPECT BPI™  are trademarks of ScanCAD International, Inc. *All specifications and designs subject to change without notice.*